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By J. M. Wang, E. S. Kuh (auth.), Hartmut Grabinski (eds.)

This booklet offers an up to date choice of the main consultant contributions to the second and third IEEE Workshops on sign Propagation on Interconnects (SPI) which have been held in Travemtinde (Baltic See Side), Germany, might 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, may perhaps 19-21, 1999. This ebook addresses the necessity of builders and researchers within the box of VLSI chip and package deal layout. It bargains a survey of present difficulties in regards to the effect of interconnect results at the electric functionality of digital circuits and indicates leading edge suggestions. during this feel the current publication represents a continua­ tion and a complement to the 1st e-book "Signal Propagation on Interconnects", Kluwer educational Publishers, 1998. The papers during this ebook conceal a large quarter of study instructions: underneath the des­ cription of common developments they take care of the answer of sign integrity difficulties, the modeling of interconnects, parameter extraction utilizing calculations and measurements and final yet now not least genuine difficulties within the box of optical interconnects.

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